From afbb4cc73c44b6321cae39dbe46b97155805097d Mon Sep 17 00:00:00 2001 From: Trygve Laugstøl Date: Sun, 13 Dec 2015 21:03:11 +0100 Subject: wip --- .../TIM/6Steps/readme.txt | 127 +++++++++++++++++++++ 1 file changed, 127 insertions(+) create mode 100644 tmp/STM32F10x_StdPeriph_Lib_V3.5.0/Project/STM32F10x_StdPeriph_Examples/TIM/6Steps/readme.txt (limited to 'tmp/STM32F10x_StdPeriph_Lib_V3.5.0/Project/STM32F10x_StdPeriph_Examples/TIM/6Steps/readme.txt') diff --git a/tmp/STM32F10x_StdPeriph_Lib_V3.5.0/Project/STM32F10x_StdPeriph_Examples/TIM/6Steps/readme.txt b/tmp/STM32F10x_StdPeriph_Lib_V3.5.0/Project/STM32F10x_StdPeriph_Examples/TIM/6Steps/readme.txt new file mode 100644 index 0000000..2fc3977 --- /dev/null +++ b/tmp/STM32F10x_StdPeriph_Lib_V3.5.0/Project/STM32F10x_StdPeriph_Examples/TIM/6Steps/readme.txt @@ -0,0 +1,127 @@ +/** + @page TIM_6Steps TIM 6 Steps example + + @verbatim + ******************** (C) COPYRIGHT 2011 STMicroelectronics ******************* + * @file TIM/6Steps/readme.txt + * @author MCD Application Team + * @version V3.5.0 + * @date 08-April-2011 + * @brief Description of the TIM 6 Steps example. + ****************************************************************************** + * THE PRESENT FIRMWARE WHICH IS FOR GUIDANCE ONLY AIMS AT PROVIDING CUSTOMERS + * WITH CODING INFORMATION REGARDING THEIR PRODUCTS IN ORDER FOR THEM TO SAVE + * TIME. AS A RESULT, STMICROELECTRONICS SHALL NOT BE HELD LIABLE FOR ANY + * DIRECT, INDIRECT OR CONSEQUENTIAL DAMAGES WITH RESPECT TO ANY CLAIMS ARISING + * FROM THE CONTENT OF SUCH FIRMWARE AND/OR THE USE MADE BY CUSTOMERS OF THE + * CODING INFORMATION CONTAINED HEREIN IN CONNECTION WITH THEIR PRODUCTS. + ****************************************************************************** + @endverbatim + +@par Example Description + +This example shows how to configure the TIM1 peripheral to generate 6 Steps. +The STM32F10x TIM1 peripheral offers the possibility to program in advance the +configuration for the next TIM1 outputs behaviour (step) and change the configuration +of all the channels at the same time. This operation is possible when the COM +(commutation) event is used. +The COM event can be generated by software by setting the COM bit in the TIM1_EGR +register or by hardware (on TRC rising edge). +In this example, a software COM event is generated each 100 ms: using the SysTick +interrupt. +The TIM1 is configured in Timing Mode, each time a COM event occurs, a new TIM1 +configuration will be set in advance. + +The break Polarity is used at High level. + +The following Table describes the TIM1 Channels states: +@verbatim + ----------------------------------------------- + | Step1 | Step2 | Step3 | Step4 | Step5 | Step6 | + ---------------------------------------------------------- + |Channel1 | 1 | 0 | 0 | 0 | 0 | 1 | + ---------------------------------------------------------- + |Channel1N | 0 | 0 | 1 | 1 | 0 | 0 | + ---------------------------------------------------------- + |Channel2 | 0 | 0 | 0 | 1 | 1 | 0 | + ---------------------------------------------------------- + |Channel2N | 1 | 1 | 0 | 0 | 0 | 0 | + ---------------------------------------------------------- + |Channel3 | 0 | 1 | 1 | 0 | 0 | 0 | + ---------------------------------------------------------- + |Channel3N | 0 | 0 | 0 | 0 | 1 | 1 | + ---------------------------------------------------------- + @endverbatim + +@par Directory contents + + - TIM/6Steps/stm32f10x_conf.h Library Configuration file + - TIM/6Steps/stm32f10x_it.c Interrupt handlers + - TIM/6Steps/stm32f10x_it.h Interrupt handlers header file + - TIM/6Steps/main.c Main program + - TIM/6Steps/system_stm32f10x.c STM32F10x system source file + +@par Hardware and Software environment + + - This example runs on STM32F10x Connectivity line, High-Density, High-Density + Value line, Medium-Density, XL-Density, Medium-Density Value line, Low-Density + and Low-Density Value line Devices. + + - This example has been tested with STMicroelectronics STM32100E-EVAL (High-Density + Value line), STM32100B-EVAL (Medium-Density Value line), STM3210C-EVAL (Connectivity line), + STM3210E-EVAL (High-Density and XL-Density) and STM3210B-EVAL (Medium-Density) + evaluation boards and can be easily tailored to any other supported device + and development board. + + + - STM3210C-EVAL Set-up + - Connect the TIM1 pins(TIM1 full remapped pins) to an oscilloscope to monitor the different waveforms: + - TIM1_CH3 pin (PE.13) + - TIM1_CH1N pin (PE.08) + - TIM1_CH2 pin (PE.11) + - TIM1_CH3N pin (PE.12) + - TIM1_CH1 pin (PE.09) + - TIM1_CH2N pin (PE.10) + - Connect the TIM1 break pin TIM1_BKIN pin (PE.15) to the GND. To generate a + break event, switch this pin level from 0V to 3.3V. + + - STM3210E-EVAL, STM3210B-EVAL, STM32100B-EVAL and STM32100E-EVAL Set-up + - Connect the TIM1 pins to an oscilloscope to monitor the different waveforms: + - TIM1_CH3 pin (PA.10) + - TIM1_CH1N pin (PB.13) + - TIM1_CH2 pin (PA.09) + - TIM1_CH3N pin (PB.15) + - TIM1_CH1 pin (PA.08) + - TIM1_CH2N pin (PB.14) + - Connect the TIM1 break pin TIM1_BKIN pin (PB.12) to the GND. To generate a + break event, switch this pin level from 0V to 3.3V. + + +@par How to use it ? + +In order to make the program work, you must do the following : + - Copy all source files from this example folder to the template folder under + Project\STM32F10x_StdPeriph_Template + - Open your preferred toolchain + - Rebuild all files and load your image into target memory + - Run the example + +@note + - Low-density Value line devices are STM32F100xx microcontrollers where the + Flash memory density ranges between 16 and 32 Kbytes. + - Low-density devices are STM32F101xx, STM32F102xx and STM32F103xx + microcontrollers where the Flash memory density ranges between 16 and 32 Kbytes. + - Medium-density Value line devices are STM32F100xx microcontrollers where + the Flash memory density ranges between 64 and 128 Kbytes. + - Medium-density devices are STM32F101xx, STM32F102xx and STM32F103xx + microcontrollers where the Flash memory density ranges between 64 and 128 Kbytes. + - High-density Value line devices are STM32F100xx microcontrollers where + the Flash memory density ranges between 256 and 512 Kbytes. + - High-density devices are STM32F101xx and STM32F103xx microcontrollers where + the Flash memory density ranges between 256 and 512 Kbytes. + - XL-density devices are STM32F101xx and STM32F103xx microcontrollers where + the Flash memory density ranges between 512 and 1024 Kbytes. + - Connectivity line devices are STM32F105xx and STM32F107xx microcontrollers. + + *

© COPYRIGHT 2011 STMicroelectronics

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