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+/**
+ @page ewarm EWARM Project Template
+
+ @verbatim
+ ******************** (C) COPYRIGHT 2011 STMicroelectronics *******************
+ * @file readme.txt
+ * @author MCD Application Team
+ * @version V3.5.0
+ * @date 08-April-2011
+ * @brief This sub directory contains all the user modifiable files needed
+ * to create a new project linked with the STM32F10x Standard Peripheral
+ * Library and working with IAR Embedded Workbench for ARM (EWARM)
+ * software toolchain (version 5.50 and later).
+ ******************************************************************************
+ * THE PRESENT FIRMWARE WHICH IS FOR GUIDANCE ONLY AIMS AT PROVIDING CUSTOMERS
+ * WITH CODING INFORMATION REGARDING THEIR PRODUCTS IN ORDER FOR THEM TO SAVE TIME.
+ * AS A RESULT, STMICROELECTRONICS SHALL NOT BE HELD LIABLE FOR ANY DIRECT,
+ * INDIRECT OR CONSEQUENTIAL DAMAGES WITH RESPECT TO ANY CLAIMS ARISING FROM THE
+ * CONTENT OF SUCH FIRMWARE AND/OR THE USE MADE BY CUSTOMERS OF THE CODING
+ * INFORMATION CONTAINED HEREIN IN CONNECTION WITH THEIR PRODUCTS.
+ ******************************************************************************
+ @endverbatim
+
+ @par Directory contents
+
+ - project .ewd/.eww/.ewp: A pre-configured project file with the provided library
+ structure that produces an executable image with IAR
+ Embedded Workbench.
+
+ - stm32f10x_flash.icf : This file is the IAR Linker configuration file used to
+ place program code (readonly) in internal FLASH and data
+ (readwrite, Stack and Heap)in internal SRAM.
+ You can customize this file to your need.
+
+ - stm32f10x_flash_extsram.icf: This file is the IAR Linker configuration file
+ used to place program code (readonly) in internal
+ FLASH and data (readwrite, Stack and Heap)in
+ external SRAM. You can customize this file to your need.
+ This file is used only with STM32 High-density devices.
+
+ - stm32f10x_nor.icf: This file is the IAR Linker configuration file used to
+ place program code (readonly) in external NOR FLASH and data
+ (readwrite, Stack and Heap)in internal SRAM.
+ You can customize this file to your need.
+ This file is used only with STM32 High-density devices.
+
+ - stm32f10x_ram.icf: This file is the IAR Linker configuration file used to
+ place program code (readonly) and data (readwrite, Stack
+ and Heap)in internal SRAM.
+ You can customize this file to your need.
+
+ @par How to use it ?
+
+ - Open the Project.eww workspace.
+ - In the workspace toolbar select the project config:
+ - STM32100B-EVAL: to configure the project for STM32 Medium-density Value
+ line devices
+ @note The needed define symbols for this config are already declared in the
+ preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_MD_VL, USE_STM32100B_EVAL
+
+ - STM3210C-EVAL: to configure the project for STM32 Connectivity line devices
+ @note The needed define symbols for this config are already declared in the
+ preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_CL, USE_STM3210C_EVAL
+
+ - STM3210B-EVAL: to configure the project for STM32 Medium-density devices
+ @note The needed define symbols for this config are already declared in the
+ preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_MD, USE_STM3210B_EVAL
+
+ - STM3210E-EVAL: to configure the project for STM32 High-density devices
+ @note The needed define symbols for this config are already declared in the
+ preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_HD, USE_STM3210E_EVAL
+
+ - STM3210E-EVAL_XL: to configure the project for STM32 XL-density devices
+ @note The needed define symbols for this config are already declared in the
+ preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_XL, USE_STM3210E_EVAL
+
+ - STM32100E-EVAL: to configure the project for STM32 High-density Value line devices
+ @note The needed define symbols for this config are already declared in the
+ preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_HD_VL, USE_STM32100E_EVAL
+
+ - Rebuild all files: Project->Rebuild all
+ - Load project image: Project->Debug
+ - Run program: Debug->Go(F5)
+
+@note
+ - Low-density Value line devices are STM32F100xx microcontrollers where the
+ Flash memory density ranges between 16 and 32 Kbytes.
+ - Low-density devices are STM32F101xx, STM32F102xx and STM32F103xx
+ microcontrollers where the Flash memory density ranges between 16 and 32 Kbytes.
+ - Medium-density Value line devices are STM32F100xx microcontrollers where the
+ Flash memory density ranges between 32 and 128 Kbytes.
+ - Medium-density devices are STM32F101xx, STM32F102xx and STM32F103xx
+ microcontrollers where the Flash memory density ranges between 32 and 128 Kbytes.
+ - High-density Value line devices are STM32F100xx microcontrollers where the
+ Flash memory density ranges between 256 and 512 Kbytes.
+ - High-density devices are STM32F101xx and STM32F103xx microcontrollers where
+ the Flash memory density ranges between 256 and 512 Kbytes.
+ - XL-density devices are STM32F101xx and STM32F103xx microcontrollers where
+ the Flash memory density ranges between 512 and 1024 Kbytes.
+ - Connectivity line devices are STM32F105xx and STM32F107xx microcontrollers.
+
+ * <h3><center>&copy; COPYRIGHT 2011 STMicroelectronics</center></h3>
+ */