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-/**
-  @page RCC_ClockConfig RCC Clock configuration example
-  
-  @verbatim
-  ******************** (C) COPYRIGHT 2011 STMicroelectronics *******************
-  * @file    RCC/RCC_ClockConfig/readme.txt 
-  * @author  MCD Application Team
-  * @version V3.5.0
-  * @date    08-April-2011
-  * @brief   Description of the RCC Clock configuration example.
-  ******************************************************************************
-  * THE PRESENT FIRMWARE WHICH IS FOR GUIDANCE ONLY AIMS AT PROVIDING CUSTOMERS
-  * WITH CODING INFORMATION REGARDING THEIR PRODUCTS IN ORDER FOR THEM TO SAVE
-  * TIME. AS A RESULT, STMICROELECTRONICS SHALL NOT BE HELD LIABLE FOR ANY
-  * DIRECT, INDIRECT OR CONSEQUENTIAL DAMAGES WITH RESPECT TO ANY CLAIMS ARISING
-  * FROM THE CONTENT OF SUCH FIRMWARE AND/OR THE USE MADE BY CUSTOMERS OF THE
-  * CODING INFORMATION CONTAINED HEREIN IN CONNECTION WITH THEIR PRODUCTS.
-  ******************************************************************************
-   @endverbatim
-
-@par Example Description 
-
-This example shows how to configure the System clock(SYSCLK) to have different
-frequencies: 24MHz, 36MHz, 48MHz, 56MHz and 72MHz (common frequencies that covers
-the major of the applications). 
-The SYSCLK frequency is selected by user in main.h file.
-
-It shows how to use, for debug purpose, the RCC_GetClocksFreq function to retrieve
-the current status and frequencies of different on chip clocks. You can see the
-RCC_ClockFreq structure content, which hold the frequencies of different on chip
-clocks, using your toolchain debugger.
-
-This example handles also the High Speed External clock (HSE) failure detection:
-when the HSE clock disappears (broken or disconnected external Quartz); HSE, PLL
-are disabled (but no change on PLL config), HSI selected as system clock source
-and an interrupt (NMI) is generated. In the NMI ISR, the HSE, HSE ready interrupt
-are enabled and once HSE clock recover, the HSERDY interrupt is generated and in
-the RCC ISR routine the system clock is reconfigured to its previous state (before
-HSE clock failure). You can monitor the HSE clock on the MCO pin (PA.08).
-
-Four LEDs are toggled with a timing defined by the Delay function.
-
-@note To adjust the External High Speed oscillator (HSE) Startup Timeout value,
-use HSEStartUp_TimeOut variable defined in the stm32f10x.h file.
-
-
-@par Directory contents 
-
-  - RCC/RCC_ClockConfig/stm32f10x_conf.h     Library Configuration file
-  - RCC/RCC_ClockConfig/stm32f10x_it.c       Interrupt handlers
-  - RCC/RCC_ClockConfig/stm32f10x_it.h       Header for stm32f10x_it.c
-  - RCC/RCC_ClockConfig/main.h               Main header file
-  - RCC/RCC_ClockConfig/main.c               Main program
-  - RCC/RCC_ClockConfig/system_stm32f10x.c   STM32F10x system source file
-
-@par Hardware and Software environment 
-
-  - This example runs on STM32F10x Connectivity line, High-Density, High-Density 
-    Value line, Medium-Density, XL-Density, Medium-Density Value line, Low-Density
-    and Low-Density Value line Devices.
-  
-  - This example has been tested with STMicroelectronics STM32100E-EVAL (High-Density 
-    Value line),STM32100B-EVAL (Medium-Density Value line), STM3210C-EVAL (Connectivity line), 
-    STM3210E-EVAL (High-Density and XL-Density) and STM3210B-EVAL (Medium-Density) 
-    evaluation boards and can be easily tailored to any other supported device 
-    and development board.
-    To select the STMicroelectronics evaluation board used to run the example, 
-    uncomment the corresponding line in stm32_eval.h file (under Utilities\STM32_EVAL)
-
-  - STM32100E-EVAL Set-up 
-    - Use LED1, LED2, LED3 and LED4 connected respectively to PF.06, PF0.7, PF.08
-      and PF.09 pins
-      
-  - STM32100B-EVAL Set-up  
-    - Use LED1, LED2, LED3 and LED4 connected respectively to PC.06, PC.07, PC.08
-      and PC.09 pins
-      
-  - STM3210C-EVAL Set-up 
-    - Use LED1, LED2, LED3 and LED4 connected respectively to PD.07, PD.13, PF.03
-      and PD.04 pins
-    
-  - STM3210E-EVAL Set-up 
-    - Use LED1, LED2, LED3 and LED4 connected respectively to PF.06, PF0.7, PF.08
-      and PF.09 pins
-
-  - STM3210B-EVAL Set-up  
-    - Use LED1, LED2, LED3 and LED4 connected respectively to PC.06, PC.07, PC.08
-      and PC.09 pins
-
-  - STM32100E-EVAL Set-up 
-    - Use LED1, LED2, LED3 and LED4 connected respectively to PF.06, PF0.7, PF.08
-      and PF.09 pins
-	  
-@par How to use it ? 
-
-In order to make the program work, you must do the following :
- - Copy all source files from this example folder to the template folder under
-   Project\STM32F10x_StdPeriph_Template
- - Open your preferred toolchain 
- - Rebuild all files and load your image into target memory
- - Run the example 
-   
-@note
- - Low-density Value line devices are STM32F100xx microcontrollers where the 
-   Flash memory density ranges between 16 and 32 Kbytes.
- - Low-density devices are STM32F101xx, STM32F102xx and STM32F103xx 
-   microcontrollers where the Flash memory density ranges between 16 and 32 Kbytes.
- - Medium-density Value line devices are STM32F100xx microcontrollers where
-   the Flash memory density ranges between 64 and 128 Kbytes.  
- - Medium-density devices are STM32F101xx, STM32F102xx and STM32F103xx 
-   microcontrollers where the Flash memory density ranges between 64 and 128 Kbytes.
- - High-density Value line devices are STM32F100xx microcontrollers where
-   the Flash memory density ranges between 256 and 512 Kbytes.
- - High-density devices are STM32F101xx and STM32F103xx microcontrollers where
-   the Flash memory density ranges between 256 and 512 Kbytes.
- - XL-density devices are STM32F101xx and STM32F103xx microcontrollers where
-   the Flash memory density ranges between 512 and 1024 Kbytes.
- - Connectivity line devices are STM32F105xx and STM32F107xx microcontrollers.
-   
- * <h3><center>&copy; COPYRIGHT 2011 STMicroelectronics</center></h3>
- */