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authorTrygve Laugstøl <trygvis@inamo.no>2017-01-25 22:24:18 +0100
committerTrygve Laugstøl <trygvis@inamo.no>2017-01-25 22:29:25 +0100
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-/**
- @page ewarm EWARM Project Template
-
- @verbatim
- ******************** (C) COPYRIGHT 2011 STMicroelectronics *******************
- * @file readme.txt
- * @author MCD Application Team
- * @version V3.5.0
- * @date 08-April-2011
- * @brief This sub directory contains all the user modifiable files needed
- * to create a new project linked with the STM32F10x Standard Peripheral
- * Library and working with IAR Embedded Workbench for ARM (EWARM)
- * software toolchain (version 5.50 and later).
- ******************************************************************************
- * THE PRESENT FIRMWARE WHICH IS FOR GUIDANCE ONLY AIMS AT PROVIDING CUSTOMERS
- * WITH CODING INFORMATION REGARDING THEIR PRODUCTS IN ORDER FOR THEM TO SAVE TIME.
- * AS A RESULT, STMICROELECTRONICS SHALL NOT BE HELD LIABLE FOR ANY DIRECT,
- * INDIRECT OR CONSEQUENTIAL DAMAGES WITH RESPECT TO ANY CLAIMS ARISING FROM THE
- * CONTENT OF SUCH FIRMWARE AND/OR THE USE MADE BY CUSTOMERS OF THE CODING
- * INFORMATION CONTAINED HEREIN IN CONNECTION WITH THEIR PRODUCTS.
- ******************************************************************************
- @endverbatim
-
- @par Directory contents
-
- - project .ewd/.eww/.ewp: A pre-configured project file with the provided library
- structure that produces an executable image with IAR
- Embedded Workbench.
-
- - stm32f10x_flash.icf : This file is the IAR Linker configuration file used to
- place program code (readonly) in internal FLASH and data
- (readwrite, Stack and Heap)in internal SRAM.
- You can customize this file to your need.
-
- - stm32f10x_flash_extsram.icf: This file is the IAR Linker configuration file
- used to place program code (readonly) in internal
- FLASH and data (readwrite, Stack and Heap)in
- external SRAM. You can customize this file to your need.
- This file is used only with STM32 High-density devices.
-
- - stm32f10x_nor.icf: This file is the IAR Linker configuration file used to
- place program code (readonly) in external NOR FLASH and data
- (readwrite, Stack and Heap)in internal SRAM.
- You can customize this file to your need.
- This file is used only with STM32 High-density devices.
-
- - stm32f10x_ram.icf: This file is the IAR Linker configuration file used to
- place program code (readonly) and data (readwrite, Stack
- and Heap)in internal SRAM.
- You can customize this file to your need.
-
- @par How to use it ?
-
- - Open the Project.eww workspace.
- - In the workspace toolbar select the project config:
- - STM32100B-EVAL: to configure the project for STM32 Medium-density Value
- line devices
- @note The needed define symbols for this config are already declared in the
- preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_MD_VL, USE_STM32100B_EVAL
-
- - STM3210C-EVAL: to configure the project for STM32 Connectivity line devices
- @note The needed define symbols for this config are already declared in the
- preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_CL, USE_STM3210C_EVAL
-
- - STM3210B-EVAL: to configure the project for STM32 Medium-density devices
- @note The needed define symbols for this config are already declared in the
- preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_MD, USE_STM3210B_EVAL
-
- - STM3210E-EVAL: to configure the project for STM32 High-density devices
- @note The needed define symbols for this config are already declared in the
- preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_HD, USE_STM3210E_EVAL
-
- - STM3210E-EVAL_XL: to configure the project for STM32 XL-density devices
- @note The needed define symbols for this config are already declared in the
- preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_XL, USE_STM3210E_EVAL
-
- - STM32100E-EVAL: to configure the project for STM32 High-density Value line devices
- @note The needed define symbols for this config are already declared in the
- preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_HD_VL, USE_STM32100E_EVAL
-
- - Rebuild all files: Project->Rebuild all
- - Load project image: Project->Debug
- - Run program: Debug->Go(F5)
-
-@note
- - Low-density Value line devices are STM32F100xx microcontrollers where the
- Flash memory density ranges between 16 and 32 Kbytes.
- - Low-density devices are STM32F101xx, STM32F102xx and STM32F103xx
- microcontrollers where the Flash memory density ranges between 16 and 32 Kbytes.
- - Medium-density Value line devices are STM32F100xx microcontrollers where the
- Flash memory density ranges between 32 and 128 Kbytes.
- - Medium-density devices are STM32F101xx, STM32F102xx and STM32F103xx
- microcontrollers where the Flash memory density ranges between 32 and 128 Kbytes.
- - High-density Value line devices are STM32F100xx microcontrollers where the
- Flash memory density ranges between 256 and 512 Kbytes.
- - High-density devices are STM32F101xx and STM32F103xx microcontrollers where
- the Flash memory density ranges between 256 and 512 Kbytes.
- - XL-density devices are STM32F101xx and STM32F103xx microcontrollers where
- the Flash memory density ranges between 512 and 1024 Kbytes.
- - Connectivity line devices are STM32F105xx and STM32F107xx microcontrollers.
-
- * <h3><center>&copy; COPYRIGHT 2011 STMicroelectronics</center></h3>
- */