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* o More clearance for the fill.HEADmasterTrygve Laugstøl2013-03-021-163/+167
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* o Bigger via pads (1mm hole, 1.5mm pad).Trygve Laugstøl2013-03-021-526/+597
| | | | o Smaller tracks (12mil).
* o Bigger pads for the funny ram.Trygve Laugstøl2013-03-022-84/+129
| | | | o Tying serial in high on the input buffer.
* shrinkingTrygve Laugstøl2013-03-011-590/+590
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* wipTrygve Laugstøl2013-03-012-135/+128
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* o Making the board a bit smaller.Trygve Laugstøl2013-02-211-604/+608
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* o wip.Trygve Laugstøl2013-02-208-1373/+9233
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* o Using a bus for the memory input too.Trygve Laugstøl2013-02-175-39/+87
| | | | o Adding a test case for reading data from RAM.
* o Less vias.Trygve Laugstøl2013-02-171-144/+111
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* o Using a record for the mcu bus.Trygve Laugstøl2013-02-166-83/+277
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* o Finished routing board.Trygve Laugstøl2013-02-166-796/+6338
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* wipTrygve Laugstøl2013-02-1014-146/+4497
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* wipTrygve Laugstøl2013-02-1015-0/+7638